Kulicke & Soffa’s Maxµmplus ultra-high speed ball bonder is for all types of ultra-fine pitch applications including 35 micron in-line pitch. Reportedly, the Maxµmplus establishes a new benchmark for fine-pitch wire bonders by delivering bond placement accuracy of 2.5 µm, at speeds of up to 10 % faster than the predecessor. An improved servo control system for the XY-table reduces wire cycle times to 63 msec. Performance is maintained for the largest bonding area available in the market, 56 mm (2.20-in) x 66 mm (2.60-in). Precision-touch bondhead technology delivers optimum bond force control. Advanced teaching and calibration software improves overall accuracy to 2.5 µm. The machine also incorporates a reduced-friction wire feed path with the capability of handling wires down to 15 µm in diameter. Other significant features include: advanced imaging technology to increase overall process productivity; a transducer which delivers optimal dynamic response with the lowest impact forces and ultrasonic energy levels; and the Precision-Arc system which enhances electronic ball control.
EPP EUROPE 437
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