The Dage series 5000 bond tester is specifically designed for ultra-fine pitch wire bonds. Wire bonding at 25 µm and below has been proven in laboratories, including the shear and pull testing of these connections. Although it is possible to verify these geometries with current solutions, these testers provide ease of use and accuracy. Capable of force measurements of up to 25 gr, the system suffers no proportionate loss of accuracy and provides improved control for the sample and tool manipulation. Added to this are optics and illumination to enable easy alignment of the tool to the sample, and a tool design being optimized for changing bond applications. An anti-vibration design also allows the system to be largely unaffected by ambient vibration around the test area. Improved step-back accuracy when shear testing ensures that the height does not become too large or too small, resulting in the tool dragging on the substrate. This sub-micron ability has resulted in the first solution dedicated to the testing of small wire bonds.
EPP EUROPE 463
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