Master Bond has formulated EP121AO, a low viscosity thermal conductive, electrically isolative two-component epoxy for potting, casting, encapsulation and sealing for service temperatures of up to 260°C. The compound is comprised of a heat-resistant liquid epoxy resin and a curing agent which exhibits high thermal stability. The mixed system exhibits a long pot (working) life at ambient temperatures, and is cured at heat ranging from 135°C to 205°C. After cure, it has a good thermal conductivity, as well as reportedly excellent mechanical strength properties, electrical insulation characteristics and thermal stability. The material features remarkable long-term heat resistant properties at temperatures in the range of 200/260°C, and can be readily subjected to repeated temperature excursions as high as 260°C. Its shrinkage is said to be negligible and it also has superb dimensional stability. EP121AO reportedly features excellent flowability and low exothermic reaction during cure. It is claimed to be widely accepted in the electrical and electronics industries wherever a high degree of heat dissipation from active power components, etc. is awfully desirable. It is available in pints, quarts, gallons, 5-gallon pails and drums.
EPP EUROPE 445
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