Universal Instruments Corporation has designed a line that can assemble 2,000 microprocessor mod ules per hour, approximately 60 to 80% faster than existing solutions. Such a processor module consists typically of a flip chip (about 12 to 15mm) with 16 to 40 chip capacitors and a connector. The substrate can be a ceramic or a high-density laminate. These are normally processed in a metal carrier with eight to twelve modules per carrier. An optimized line consists of a printer to apply solder paste to the substrate, high-speed chipshooter to pick-and-place the chip capacitors and the connector, a flip-chip placement machine with integrated dip fluxing, and a reflow oven. For applications featuring high capacitor count, two chipshooters would be required to optimize tact time. The GSM Genesis platform features a twin-beam gantry system and proprietary linear motors, to deliver an “unbeatable combination of high accuracy and high speed”. Each beam can support one of three different heads: 30-spindle rotary head for chip placement – considerably smaller than equivalent turret heads typically deployed to place small discrete components; 7-spindle head with integrated cameras – for additional flexibility to handle a wide range of components; 4-spindle pressure-enhanced (PE) head used in conjunction with high resolution, an upward-looking camera to place challenging components, demanding higher accuracy. A Genesis chipshooter configured with two Lightning heads can assemble 32,000 to 37,000 capacitors per hour (empirical user data). The optimal tact time for a line is between 18 and 20 sec. To achieve this, a module comprising of 16 to 20 capacitors can be addressed by a single chipshooter, while modules with 20 to 40 capacitors require a second chipshooter. The Genesis flip-chip machine features two PE heads. The motion-control parameters such as acceleration, settling band and stabilization time are also optimized for higher accuracy. A special low-viscosity fluxer is integrated. With feed from waffle packs, the Genesis can assemble 2000 flip chips per hour. Cost of ownership and of assembly studies undertaken in Asia reveal costs down to approximately $0.0008 per capacitor and $0.012 per flip chip. The entire line is also substantially shorter than comparable solutions which is important for factory floor utilization.
EPP EUROPE 403
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