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Stencils to enhance adhesive deposition

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Stencils to enhance adhesive deposition

Stencils to enhance adhesive deposition
DEK VectorGuard PumpPrint stencils are available in two standard sizes, 23 x 23-in and 29 x 29-in, and initially in 0.12-in thickness. Their mounting system eliminates the mesh and aluminium frame of standard PumpPrint stencils. The tensioning system attaches directly to the stencils by engaging in the channel specially routed around the circumference of the stencil. The standard VectorGuard frames can be used without modification. This makes the stencils easy to setup to print adhesive. It also protects existing investments in VectorGuard technology, by allowing VectorGuard frames to be used directly for PumpPrinting as well as for stencil printing. The compact storage systems (printer caddy or cabinet) are also compatible with the stencils. PumpPrinting delivers a convenient, flexible, high throughput solution to depositing adhesives for SMT applications. The technique is performed using a printer and an acrylic PumpPrinting stencil, which are thicker than laser-cut stainless-steel stencils for solder paste. It allows large numbers of adhesives deposits of almost any shape and size to be made on print sides of PCBs at high speed, with 8s cycle times quite possible. PumpPrinting also obviates the capital investment in dispensing equipment, and the printer may be reassigned to solder paste printing as required. The method is not restricted to adhesives, applications such as silver epoxy die attach on pre-populated substrates, extrusive reflow (printing solder onto through hole leads) and high solder volume applications such as shield attachments which are becoming increasingly important.

EPP EUROPE 430
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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