Using laser-microjet technology, the Synova ultra-speed stencil laser-cutter (LSS) stands for the next machine generation designed to provide stencil and metal mask manufacturers with an efficient tool. The LSS cuts up to 20 holes per second without any heat damage, burrs or oxidation. Large working areas up to 800 x 1000mm are available. A second laser head may be added, thereby doubling the throughput. This cutting system is characterized by a high mechanical precision (better ±5 micron), a 2.5 tons granite structure for vibrations dampening, low operating costs, a precise stencil fixture (with or without frame) and a reliably operating laser source. Reportedly, the system perfectly meets high-accuracy requirements, and is already installed in the semiconductor (for packaging solder masks) and flat-panel display industry.
EPP EUROPE 422
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