Developing reflow profiles for new product runs can eat up production time, especially with complex assemblies. In a high product mix environment, too much process development time can eat into productivity. AUTOset, a software feature developed by Vitronics Soltec in partnership with KIC, takes advantage of years of process knowledge developed in reflow profiling by both companies. The software enables the manufacturing engineer to get a “jump start” on process development by generating a preliminary reflow profile based on a PCB assembly’s physical characteristics. He can then ‘fine tune’ an optimized profile from the preliminary recipe. The software subsystem incorporates KIC Vision auto-profiling technology. The software feature is installed in all new XPM3 Series reflow soldering machines. It eliminates the need for the operator to “guess” an initial oven recipe, by using an algorithm to calculate the ideal oven recipe based on input data. The engineer inputs information about the PCB to be processed – physical dimensions, solder type, etc., which allows the software to identify a suitable oven recipe prior to running a single profile. The software not only saves process development time, but also energy and operating costs by generating more efficient profiles from Vitronic Soltec’s vast informational database and more than 15 years of developing optimized thermal profiles for reflow ovens. The software feature will work with any third-party thermal profiler, including KIC and ECD products.
EPP Europe 428
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