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Small Passive Rework Application Package Offers 5 µm-Placement-Accuracy

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Small Passive Rework Application Package Offers 5 µm-Placement-Accuracy

Small Passive Rework Application Package Offers 5 µm-Placement-Accuracy
The Small Passive Rework (SPR) application package allows reproducible rework results for circuits of 01005 components (size 0.25 mm x 0.125 mm). For such components each conventional attempt to repair, e.g. using a handheld soldering iron or an infrared system, is doomed to failure. Therefore, safe handling is extremely difficult. Among others, the force in z direction, used during pick-up, placement and soldering, has to be controlled exactly to avoid damages, e.g. cracks or ruptures, to the component’s body. The SPR application package is a problem specific module combination for small passives rework, such as 0201 or 01005. An integrated dispenser for solder paste and a fine resolution video system, offering 5 µm-placement-accuracy, are highlights of this package. Optional motorization of the reflow arm allows controlling the force of attachment with a resolution of 0.1 N, making the rework process user independent and thus significantly safer.

All rework steps, viz desoldering, solder removal, dispensing, component pick up and placement, as well as soldering in, are managed within one single machine. The SPR package is a real Fineplacer rework station. But it is also capable not only of reworking small passives, but also BGA, CSP, QFP, TSOP, MLF, QFN and all other recently introduced SMDs. For these applications, the dispenser may also be used with adhesives or underfill.
EPP EUROPE 426
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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