Universal Instruments has trimmed the footprint and increased the maximum board size for its high-speed placement platform4797R HSP, to provide more flexibility in a smaller footprint. And with up to 96 feeders (dual-track), these are not achieved at the expense of lower throughput or limited component access, and placement speed is maintained at 48,000cph. Minimum placement tact time is 0.075 sec., feeder-axis tact time is 0.09 sec. or 0.08 sec. with dual-track feeder. The platform is capable of handling boards up to 610mm (24-in) length and 460mm (18-in) width. Universal has achieved this within a small footprint machine measuring 3,100mm (122-in) long and 2,155mm (85-in) deep. Placement accuracy is specified ±0.08mm for MELFs and small chips, and ±0.05mm for leaded components – all at 3-sigma. The equipment can operate stand-alone or grouped with other machines for increased flexibility and volume. It is ideal for assembling high volumes of standard products, as well as larger boards such as backplanes or motherboards. And its wide component range makes it productive in high-mix environments. Additional standard gear includes twelve 5-spindle, direct-drive placement heads and software for off-line programming. Options include component library data teach, pattern program data teach, barcode validation, traceability package, BGA/CSP recognition, black-light camera and GEM/SECS II interfacing.
EPP EUROPE 427
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