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Siemens to strengthen substrate drilling business

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Siemens to strengthen substrate drilling business

In the field of PCB laser drilling, Siemens Dematic Electronics Assembly Systems (SD EA) is currently adjusting itself even more strongly to the highly potential Asian market. Its microbeam systems make use of innovative laser technology to produce the smallest microvias in diameter on substrates and PCBs. The company will be concentrating its sales and service operations in Taiwan. As Udo Wiggermann, head of this business segment, states, “The Asian region is now – and will remain so in the future – the market with the world’s highest growth rates in PCB production and substrate technology. We want to bring our breakthrough Microbeam technology even closer to these customers. Another important reason is that Asia is giving us the really decisive technological impulses for our business. Our customers all over the world are benefitting from the combination of this impact, and the quality and reliability of our highly accurate machines.” The sales center of this business unit will immediately move to Taiwan. After completing the current pilot applications, the company plans to contract with an important sales partner to boost its market presence even more.

EPP EUROPE 404
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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