The Seica selective soldering system A30 Firefly is a flexible and clean solution, utilizing a laser system mounted on X, Y, Z axes with automatic wire-solder feeder to carry out precision operation on boards. The system can be configured to solder either from the top or bottom side of a board, and features SMEMA-compatibility for ease of integration in manufacturing lines. The laser soldering brings significant advantages to the process compared to other methods, since it is a non-contact operation, capable to access very small areas. The spot-like concentration of the heat generated by the laser reduces high temperature exposure to adjacent components.
EPP EUROPE 422
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