Cobar’s S63-OA water-soluble solder paste is stable, reportedly offering extended shelf and stencil life, and delivering excellent activity and results under thermal load in lead-free reflow soldering. The paste is available in most common alloys, including an anti-tombstoning formula, as well as in several powder classes. This paste is claimed to be easy to print even with relatively high speed in fine-pitch applications. Soldering performance is excellent and the residues rinse free in a straight aqueous (water) cleaning process.
EPP EUROPE 436
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