The Finetech mobile device-rework pack with integrated solder-paste dispenser (MDR) has been developed for the demand of mobile phones, PDAs, handhelds, multimedia portables, bluetooth and WLAN gear, memory cards, notebooks, etc. This repair system can dispense dots small enough for exchange of 0201-parts, and additional materials including epoxy and underfill. Equipped with a motorized placement module, the system achieves a high degree of reproducibility and minimizes operator influence. The software accurately controls bond force during placement and soldering of the components, resulting in a production-compatible reflow process guaranteed to produce higher yields. The package reportedly provides the capability of performing the rework process for the smallest of devices (0201-chips) up to large RF shields, as well as conquering the challenge presented by extremely high-density packages on complex board assemblies. The operation cycle includes component removal, residual solder clean-up, fresh paste dispense as well as part placement and soldering. A fully automated version is also available.
EPP EUROPE 432
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