The rework station PDR X310 provides a low cost entry, with an upgrade path to high-end. The unit is based on a focused IR technology providing instant and precise control over the entire process. It is suitable for rework using a wide range of components, such as chip SMDs, BGAs, CSPs, flip chips, 0201s – and supports lead-free applications. The unit does not require nozzles, focus hoods or shields. It can be used with any size or shape of component simply by adjusting the aperture of the lens attachment. The standard lens delivers IR heating spots from 25 to 70mm in diameter, optional with sizes down to 4mm. The system is reportedly easy to set up and use, and delivers a clean process. The mechanics, optics and controls allow the operator to pick up a part, align it, place it onto fluxed pads and reflow using accurate closed-loop temperature control. The portable benchtop-mounted workholder handles boards measuring up to 300 x 250mm. The built-in 500W infrared board preheater is suitable for working on zones of up to 120 x 120mm. Component placement is achieved using vacuum operated pick and place, with precision Z-axis movement and 360°-rotation. An IR sensor measures the component temperature during the procedure, monitored in real-time. The modular and upgradeable unit can be provided with options such as ThermoActive software suite, a prism-based BGA/micro-BGA alignment device for simultaneous viewing of board and component and a component nest and paste application facility, plus XY-workholder with micrometer adjustment.
EPP EUROPE 427
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