With the Martin Multi-Reball-04 gear, gentle and surprisingly simple reballing for a secure reuse of BGAs and CSPs has been propelled into an interesting phase, even for production runs. Whereas reballing tools have before only allowed single use in mini-convection ovens, this tool opens fresh perspectives for batch production and higher quantities. Soldering up to nine components in a single cycle within only 4 minutes. It only takes reportedly 30 to 60 working days to repay the investment, since valuable used BGAs or CSPs can often be reballed. A prerequisite for this gear is the precision-controlled IR underheater. It provides reproducible and consistent temperatures, which is completed with nitrogen. The unit is also suitable for lead-free solder balls. Control is carried out by using the program Easy-Reballer. Soldering profiles can be established quickly with the Quick-Profiler. Reballing involves pouring tiny solder spheres into openings of a mask, positioned above a BGA or CSP, cleaned thoroughly of old solder. The component is positioned in a holder of the mini oven. Any excess balls are simply poured back into the jar. When all openings of the mask are occupied by a ball, the unit is closed and reflow can start. Whether single or multi reballing, BGAs or CSPs, all tools and Mini Oven sets, full grid masks or specials are available from the company. Solder spheres, too, leaded or lead free, in sizes from 0.3 to 0.889 mm are offered in the online express shop.
EPP EUROPE 440
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