Reel Service Ltd. is offering a tape-and-reel service for bare dies and flip-chip (FC) devices from wafers. This proposal will benefit waferfabs and PCB assembly houses especially in Europe who produce or use bare die and flip chips by delivering these complex components in tape-and-reel format for high-speed placement operations. The supply system is complemented by investment in production facilities for the design and manufacture of ‚MicroTape at the Glenrothes/Scotland facility. This unique specialist die-tape is specified by a number of wafer-level device manufacturers. The offering allows now manufacturers and users alike to have their die-based products processed within Europe, thus reducing remarkable freight costs and extended timescales usually associated with overseas processing. The totally automated equipment, the first of its kind in Europe, incorporates modern vision systems to process, inspect and place die and flip chips ranging from 0.5mm to 10mm square with pinpoint accuracy.
EPP EUROPE 430
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