The assembly of camera modules/image sensors requires flexible equipment with a broad functional range, high precision and throughput. The Datacon 2200 platform of multi-chip die bonders deliver such capabilities, and can be tailored to the task thanks to their modular concept. A typical CMOS-camera module consists of imaging chip, optical (infrared filter and lens) and mechanical (lens holder) parts, to be assembled with extreme precision. For economical reasons, several of these camera heads are assembled on a BGA multiple carrier measuring up to 50 x 200mm or on ceramic single substrates. The assembly has to be provided with high precision and requires a clean-room environment. The equipment complies with the class-100 cleanroom standard, ensuring laminar airflow in the machine to prevent settling of particles in the work area.
EPP EUROPE 437
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