Ekra’s Oppus I post-print inspection (PPI) system delivers complete 3D analysis and assessment of solder printing during SMT, hybrid and advanced-packaging applications. This efficient solder print inspection system excels by short inspection time, high precision and easy handling at a favorable cost-performance ratio. It is based on a modular inline concept deploying highly precise and extremely fast sensor technology, using fast moiré interferometry following a cooperation with SolVision. Essential features of Oppus I are the program teaching process and a quick set-up, offering high process security at optimized handling comfort. Generating a program for a complete board including all settings takes about five minutes. Central to the system is a digital camera with a projector unit that projects white light structures onto any surface. The 2 and 3D information from the measured object are extracted simultaneously from the system. By using just one camera, calibration, mounting, alignment and any maintenance work become much easier compared to technologies that use several cameras. The next step is using adaptive artificial control: the PPI system and a very precise printer communicate to exchange data. This exchange makes it possible to run a trend and parameter analysis after every printing cycle. By sending back the inspection results to the respective interfaces of the print system, the complete printing process is surveyed. With this, potential faults can be recognized early, avoiding expensive print errors, and it offers features like stencil measurement.
EPP EUROPE 424
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