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Placer for SMDs and advanced packages

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Placer for SMDs and advanced packages

Placer for SMDs and advanced packages
Universal Instruments’ placement platform AdVantis XS is designed specifically for the convergence of semiconductor and surface-mount assembly, deploying VRM linear motors for reportedly exceptional accuracy and repeatability. AdVantis XS is claimed to be the evolution of the company’s GSMxs, delivering similar accuracies of ±9µm at ±3-sigma, but with a 25% increase in feeder capacity at the machine and a 15% speed improvement. At the same time, the advanced engineering and optimized design leads to a competitive price some 25% lower than its predecessor, while the platform philosophy ensures high levels of backward compatibility, shared resources and common interfaces – even extending to the GSM Genesis range. Overall, the company claims a cut in cost of ownership by 40% which, in turn, reduces cost-per-placement in the competitive flip-chip segment. It reportedly provides a lower-cost alternative sought by those in low-margin assembly applications who still require high accuracy placement of flip chip and other advanced packages without sacrificing the strengths, such as robustness, modularity and scalability. The linear-motor-drive delivers all the capability and functionality demanded by high-end assembly. Moreover, included are also high magnification cameras, flip-chip algorithms, low-force capability, heated spindles, fluxing, dispensing and a variety of feeder types. It is also Class 1000 cleanroom compatible. Due to this, the high accuracy capabilities enlarge the equipment use into system-in-package (SiP) assembly.

EPP EUROPE 443
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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