LPKF Laser & Electronics introduced its MicroLine C-series laser system for cutting and depaneling board assemblies as well as PCB panels at high speeds. The laser-based machine features contact-free operation, so it easily separates assembled circuit boards without subjecting the PCBA to milling stress. It cuts any aperture shape and produces accurate contours around densely populated component areas. With a powerful C02 laser, the cutter does not require any expensive mechanical tools or adapters to accurately milling boards on the worktable. This makes it a cost-effective solution for processing medium-sized and small-quantity tasks. A fiducial recognition system makes the equipment more accurate than mechanical or tool-based procedures by using layout-reference marks to adapt the working data to the position and size of the circuit. The machine is capable of cutting and drilling various organic materials, as well as structuring organic layers.
EPP EUROPE 430
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