The Almit LFM-48 TM HP Pb-free solder paste is a latest-generation tin-copper-silver alloy formulation reportedly exhibiting good wetting, easy low-residue printing with long screen and tack life. It is reportedly already approved by, and in use with, major manufacturers, and is suitable for both open-blade printing (squeegee) and enclosed print-head systems. The cored solder wire KR-19SH RMA is also now available in industry standard Sn96.5Ag3Cu0.5 (SAC) alloy. The wire is being offered in a range of diameters from 0.3 to 1.6mm on 0.5kg-reels – and in selected sizes on anti-static reels.
EPP EUROPE 424
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