Speedline Technologies has designed the MPM next generation paste pump technology, featuring an innovative design that reduces materials costs, facilitates quick changeovers and expands the range of usable materials. The supplier claims that the pump can be used with a wider variety of materials, including solder paste, adhesive and certain fluxes, when compared with existing pump technologies. Its design reportedly provides users in electronics manufacturing with significant materials savings while also reducing downtime production costs associated with product changeover. The pump construction represents a unique approach to paste management, featuring a smaller paste chamber that reduces material waste and compaction, and disposable inserts for simplified cleaning and reduced maintenance downtime. Improvements in product yield are achieved through proximity membrane sensing and direct pressure control, enabling accurate material deposition, especially for challenging paste-in-hole applications. This pump uses standard cartridges and MPM’s pressurized printing technology.
EPP EUROPE 429
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