SAC3-XM5S is Cobar Solder Products‘ no-clean solder paste for lead-free SMT assembly. Its proprietary synthetic base gives it stability under the higher temperatures required by lead-free alloys. Thus, it will not slump when heated, and works well in air or under a nitrogen blanket. It is compatible with many different finishes including OSP, Ni/Au, Ag and Sn. The solder paste prints well with good definition, and is designed specifically for stencil printing without smearing. It cuts down on the frequency of stencil wiping required. The solder paste remains stable and active during extended heating at elevated temperatures. Recommended soldering temperature range is 235 to 245 °C. Alloy: Sn96.5/Ag4/Cu0.5.
The solder paste is available in most common SAC-alloys, including an anti-Tombstoning type, and in several powder classes. Reportedly, it produces void-free lead-free solder joints, characterized by excellent wetting.
www. cobar.com
EPP Europe 421
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