Speedline Technologies’ UltraFill lead-free feature an innovative design and technology with 40% wider size to increase contact length and dwell time. The nozzles are also placed closer together to reduce the temperature drop between them, so that less heat is needed to reflow solder joints in the second wave. As a result, UltraFill nozzles deliver better hole fill without requiring a slowing of the conveyor, while reducing bridge defects and dross production. A nitrogen cover is available as an option, allowing for either air or nitrogen operation without the need to change nozzles. The covering both encompasses the nozzles in the pot and the dross in the solder pot. The hood lifts for easy maintenance and dedrossing – without nozzle removal. The nozzles enhance product quality as well process performance – ranging from the elimination of the need for touch-up of poor hole fills to dramatic reductions in bridges/solder shorts. The nozzles are available an option on the Vectra and Electra wave-soldering systems or as upgrade to existing equipment, and are compatible with the Omega wave and the Debridging Airknife.
EPP EUROPE 434
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