Cuprostar CVF1 acid copper plating process has been introduced by Enthone Inc. Specially developed for filling blind microvias and plating through-holes simultaneously in vertical DC applications, the process fills blind microvias flush with the surface, completely eliminating the potential for cavities, and the entrapment of moisture or residues, while significantly reducing solder joint voids associated with “via-in-pad” applications.
Unlike competitive copper via fill processes, it does not require electrolytic regeneration, continuous carbon filtration or troublesome start-up and shutdown procedures.
The process delivers benefits including 100 % via fill for large and small vias, a throwing power of greater than 90 % with 5:1 aspect ratio plated through-holes, and utilizes existing vertical DC equipment.
CVF1 offers improved reliability over other acid copper via-fill processes currently used today, by eliminating the difficulties in control of several components in the plating bath and the need for Pulse Periodic Reverse (PPR) rectification. Its use prevents the build up of a high organic content and eliminates the need for frequent carbon treatment or bath disposal
EPP EUROPE 424
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