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Mydata introduces first stencil-free solder-paste printer to market

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Mydata introduces first stencil-free solder-paste printer to market

Mydata introduces first stencil-free solder-paste printer to market
The Mydata MY500 jet printer is the SMT industry’s first stencil-free printer. This concept for applying solder paste to PCBs reportedly offers many advantages over stencil printing. The system, the result of about seven years R&D efforts, uses a patented jet-printing technology to shoot small volumes of paste at 500 dots/second (1.8m dots/hour). According to CEO Mårten Lundberg, the MY500 is the most important innovation in the company’s 20-year history. “Since 1986, when we first launched our pick-and-place machine, we’ve always placed a strong emphasis on R&D. The MY500 is the result of a lot of research into how to make the SMT process more flexible and therefore more efficient”. The machine can apply paste dots small enough to reflow finely structured mainstream IC packages, such as 0.4mm QFP. The solder joint fulfills IPC SM-782A requirements. With the MY500, the company also claims that board assemblers can more quickly optimize solder-paste application, thereby increasing quality and significantly lowering costs. Because the printer needs no stencils, operators can change the print program in a matter of seconds. Furthermore, they can control the volume of paste deposits for each pad – an ‘on-demand’ benefit that is not possible with conventional stencil printers. To develop this technology, the Swedish company teamed up with a number of leading paste suppliers, including Nihon Almit and Senju, etc.

The printer comes in three parts: the printer itself, the printing cassette and cartridge and off-line programming software. Linear motors transfer the paste cassette in the machine, and a laserized instrument measures the board height. The ejection technology that enables printing of paste on the fly is contained inside a lightweight cassette. The cassette holds a replaceable cartridge. It only takes a few seconds to load a cartridge into the cassette. Thanks to the design of the cartridges, solder paste is not exposed to oxygen until it hits the PCB so there is no messy cleaning. Other key benefits include: no more waiting for stencils to arrive from laser cutting; no more stencil costs; no more hazardous solvents to clean stencils; instant control over paste volumes on pads; flexible programming; and lower consumption of paste. The printer can handle boards from 50 x 50 to 508 x 508mm in size, 0.4 to up to 7.0mm thick and up to 5kg in weight.
Productronica, Booth A5.337
EPP EUROPE 421
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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