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Modular platform with throughput of 95,000 cph

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Modular platform with throughput of 95,000 cph

Modular platform with throughput of 95,000 cph
The modular direct drive mounter GXH-3 with maximized throughput from Hitachi High-Technologies Europe GmbH is capable of placing components at ultra high-speed and handling odd shape parts. Beside of the throughput of 95,000 cph the GXH-3 has been improved in comparison to the current type GXH-1S in regard to operability, prevention of operation errors, easier handling and visibility. At the same time optimized modular expansion GXH-3J is introduced. While GXH-3 is offering 4 gantries (see image), the GXH-3J is equipped with 2 gantries. The modular concept of the GXH-platform allows defining for each production line the best configuration, for example, with 2 gantries (GXH-3J), with 4 gantries (GXH-3) or with 6 gantries (GXH-3 plus GXH-3J). The GXH-3J can be used to increase the component-handling spectrum, to increase the production throughput and to optimally expand the existing production capability according to the demand. The direct drive modular system places chips on PCBs at a theoretical throughput of 95,000 cph (GXH-3J: 47,500 cph) using “direct drive head technology”. The machine is suitable for a wide range of component types. This placement system can be equipped with high-speed heads to place components from 01005 to 44 x 44 mm and components height of 12.7 mm, or alternatively, with multifunctional heads, which allow handling of components up to 55 x 55 mm and a height of 25,4 mm. Possible component packages are QFP/BGA, CSP, odd shape components and connectors up to 100 x 26 mm. As a result of the interchangeable and modular concept, it is also possible to combine high-speed heads with multifunctional heads in one machine. The mounter offers 4 gantries, each with one placement head. Each of the 4 heads is equipped with 12 nozzles. The XY-axes have linear motor drive, which allows high-speed and high-accuracy positioning. The enterprise achieves high placement accuracy by using its well-proven line sensor, which not only checks the presence of the component on the nozzle, but is also feeding back to the Z-axis for optimum placement descent. This placement system offers one-shot recognition of 12 components on the fly. Furthermore the mounter can handle boards up to 460 x 460 mm (optionally 610 x 460 mm) and allows loading of maximum 200 component types in 8 mm dual tape feeders (GXH-3J: 100 component types). The intelligent electronic feeder system allows full component traceability. Changeover is quickly done by use of a bank feeder change cart. Tape splicing can be done without stopping the machine.

GXH-3 and GXH-3J are ideally qualified for both low volume batch production with a wide variety of components, and for mass production.
Productronica, Stand A5.358
EPP Europe 445
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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