A non-destructive, nanotechnology weight metrology tool handles high volume production of 300 mm semiconductor wafers. The Mentor DF3 has also been designed to easily adapt to handling a mixed wafer fab environment where 200 mm and 300 mm wafers are continually interchanged. The versatile system offers atomic layer measurement accuracy using innovative nanotechnology weight metrology methods. The tool is capable of measuring down to resolutions as low as 10 microgram (approximately one Angstrom of material thickness). The metrology tool is equipped with a standard Equipment Front End Module (EFEM) housing an atmospheric robot within a mini-environment. The wafer handling capabilities of the tool rely on two 300 mm Front Opening Unified Pods (FOUPs), located side by side at the front of the system.
Capable of throughputs in excess of 60 wafers per hour, Mentor DF3 tool has a small-footprint of only 2 m² and provides nanotechnology weight measurement of product, test and blanket wafers independent of substrate size or material. Mentor DF3 is designed to monitor changes in process performance and quickly determine whether device manufacture process steps are operating correctly. This tool enables process changes to be reliably and accurately determined after deposition, wet or dry etch or CMP processing.
EPP EUROPE 449
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