The Swiss PCB manufacturer GS Praezisions AG with long-standing experience in HDI circuits continues to invest in leading-edge technology such as laser-direct imaging (LDI), specializing in miniaturized rigid, rigid-flex and flexible circuit boards for bio-medical and high-frequency applications. The latest offering includes MCM-L substrates (multi-chip module – laminated) which promise to replace more expensive ceramic thick-film carriers. Such boards incorporate chip-on-board technology (COB), where the dies are directly bonded or flip-chipped to the substrate carrier (4-mil pad pitch). An added advantage over ceramic is the possibility of having multi-layer boards allowing much higher integration levels. Via as small as 2.2-mil are drilled using plasma or laser technology.
EPP EUROPE 460
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