DuPont Microcircuit Materials has launched System LF, a series of materials for the production of lead-free hybrid circuits. It is designed for the move to lead-free production of multilayer ceramic modules, consisting of conductors (gold, silver, palladium-silver, platinum-silver), dielectrics, via-fills and overglaze materials). These thick film compositions are applied onto ceramic substrates by printing and subsequently fired to form interconnect tracks and pads. The components are all free of cadmium and Pb, and allow manufacturers to go beyond the RoHS directive. All components are compatible, to facilitate their introduction into the manufacturing process, and reportedly perform to the same high standards achieved with traditional thick film compositions.
EPP EUROPE 424
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