The Qualitek DSP 889 lead free, no-clean solder paste reportedly provides as much as 10 to 12% higher metal volume than typical lead-containing alloys, promoting better wetting and spreading. Special fluxing activity levels offer thermal stability and prevent thermal degradation when reflowing. According to supplier, use of nitrogen is not required, so the paste will eventually provide cost savings. The alloy is said to exhibit high joint strength, excellent wettability, extraordinary print definition and tack life, and conforms to J-STD-004 flux classification ROL0.
EPP EUROPE 437
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