DuPont’s lead-free silver/platinum thick-film conductor paste LF 171 is applied onto ceramic substrates and dielectric compositions by screen printing, and subsequently fired to form interconnect tracks and pads. Along with the current lead-free dielectrics QM 42 and QM 44, the conductor paste allows ceramic circuit manufacturers to move a step closer to completely lead–free systems. The paste has good solderability and aged adhesion with lead-free solder and is compatible with QM 44, 2000 series resistors, gold and copper conductors. In addition, the ink reportedly offers excellent fine-line printing, heavy aluminium wire bonding and thermal cycle adhesion.
EPP EUROPE 436
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