The 250HR laminate and prepreg materials of Polyclad Laminates, a business of Cookson Electronics, has a 150°C glass transition temperature (Tg) and 350°C decomposition temperature (Td), ideally suited for mid-Tg, lead-free applications. The CAF-resistant materials maintain low expansion rates while retaining FR-4 processability. The material meets the demand for mid-Tg, lead-free enabling laminates/prepregs that deliver superior and consistent performance. It allows obtaining lead-free assembly compatibility in a standard FR-4 material. Used in the manufacture of automotive electronics, computer servers, telecommunications devices and others, the Polyclad 250HR offers thermal performance and reliability, and contains a special multifunctional epoxy-resin technology for reduced CTEs (temperature coefficients). UL listed as PCL-FR-250HR laminate and PCL-FRP-250HR prepreg, the material is reportedly compatible with all commonly used FR-4 fabrication process techniques. It is laser fluorescing and UV blocking for maximum compatibility with AOI systems and optical positioning systems as well as photoimageable solder mask imaging.
EPP EUROPE 429
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