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IPC and JEDEC host conference on lead-free manufacturing

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IPC and JEDEC host conference on lead-free manufacturing

The IPC (Association Connecting Electronics Industries) and JEDEC, the Solid State Technology Association, will prepare manufacturers for the upcoming European ban on lead by co-sponsoring the 10th International Conference on Lead Free Electronic Components and Assemblies. The conference will be held October 17 to 19 in Brussels, Belgium. David Bergman, IPC’s VP of standards, technology and international relations, Jean Hebeisen (IPC), as well as John Kelly and Donna McEntire of JEDEC, will co-chair the symposium program. There will be speakers from around the world to present and discuss a multitude of lead-free issues, including RoHS implementation, dealing with assembly costs, theory and practice of lead-free BGA assembly using Sn-Pb solder; manufacturing considerations for thermally enhanced SO-8 packages, driving force and excess energy in tin deposits for whisker growth, etc. The event will also offer eight workshops covering highly topical issues, and major industry suppliers will showcase their products and services in tabletop displays.

EPP EUROPE 408
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2022
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