Speedline Technologies has released the Benchmark 5.0 software of its Camalot XyflexPro liquid-dispensing system for surface-mount and chip-packaging applications. It offers significant benefits, including increased throughput of up to 15%, improved process control and enhanced program functionality. Features include a flip-chip calculator, used to determine underfill weight and volume for both die within a cavity, and standard assembly methods. The “Turn Back” function allows the dispense units or pumps to be reversed. This gives precise control of material on the needle tip, and can be used to eliminate material balling or dripping due to backpressure. The die-edge detection is a one-snap process that simultaneously finds all four edges of a flip chip ensuring pinpoint positioning. The vision algorithms have been further developed for edge find of any rotated die, CSP/BGA and other molded packages. In addition, cycle time is dramatically decreased. As a result of reportedly creative concepts based on user expertise, these functions are included: a line sequence command, which enables faster, smoother travel around corners when dispensing underfill; encapsulation and micro-display applications; needle cleaning during product transfer, not during process time; faster vision processing; and a pipeline conveyor mode that allows parallel product transfer between transport zones, reducing transfer time by up to 40%. The software is easily upgradeable and is available as option for all XyflexPro machines in the field – and shipped standard on XyflexPro+ systems.
EPP EUROPE 439
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