The CS1250 high speed sorter for WLCSP and other flip chip devices from Laurier can now transfer die to tape reel at more than 16,000 parts per hour, while performing full inspection at every step of the process. According to the company this die sorter platform is the fastest chip to tape reel machine in the industry. “Several breakthroughs in technology have enabled the throughput increase of over 30 %,” explains Scott Evans, Die Sorter Product Manager. “Die placements of 16,000 per hour is not the sprint rate, it’s the actual taping speed”. This includes full inspection of the device before picking, after flipping, in pocket, and post cover tape seal. We have run this process with WLPs as small as 1.13 mm x 1.77 mm. The average UPH was 16,050 into 8 mm tape with a 4 mm pitch and pressure seal cover tape. Features include 4 point vision inspection, real time wafer map status, touch screen, automatic calibration and auto tape load. The standard system handles 300 mm wafers. It is characterized by ease-of-use, low maintenance requirements, quick changeover and ultra-high throughput.
EPP Europe 443
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