For reliability tests of board assemblies and components, the exposure to rapid thermal cycles achieves superior results in less time compared to time-consuming storage procedures. Still higher efficiency is achieved if temperature-changing rates are even faster. The rapid thermal-test systems from Vötsch are designed especially for ESS (environmental stress screening) to fill the gap between temperature and shock-test systems. The most effective method is the application of thermal cycles to precipitate early defect mechanisms in components. Quick test tailoring with the decision of optimal test conditions and running of specified standards can reportedly be realized problem-free. The stress-screening systems VTS and VCS are available in volumes of 190 to 1540l, and the temperature ranges from –40 to +180°C and –70 to +180°C. Favored temperature changing rates are 5K/min, 10K/min and 15K/min. Gradients up to 30K/min within a single test chamber (purely mechanically cooled) can be realized upon request. These systems, boasting enhanced heating and cooling performances, expose components to high temperature gradients and reveal (if required in conjunction with electrical stress) major defects in components. The ESS systems are available with a removable floor to realize integrated test environments with electrodynamic shakers.
EPP EUROPE 446
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