Especially for the smart-card manufacture, Datacon has developed the 8800 FC Smart Line for high throughput and precision as well as 100% inspection and tests, all in small footprint. Three machine modules interlink seamlessly: the flip-chip bonder with integrated dispenser, curing station with electrical testing, and a unit for optical inspection and reject-marking. A dual-head dispensing system, with needles for small dies and a showerhead for large dies, offers fast and precise adhesive application, with two on-line cameras monitoring the substrate adjustment and checking that the adhesive is applied correctly. The bonding system ensures a throughput of 8500cph with a process accuracy of 25µm@3-sigma. The adhesive is cured with a multi-thermode bond head, guaranteeing a quick pitch change between 9.5 and 14.25mm. Automatic cover-tape handling prevents contamination of the thermodes by adhesive. The tester controls the electrical function of the products. The optical inspection checks the adhesive formation around the chips. If outside of the process tolerance, they are marked by a punching machine, whereby the hole destroys the substrate structure and thus prevents mistaken use of unserviceable parts. Only 100%-tested material leaves the production line. One array of 32 bond positions at a time is dispensed, bonded, cured, electrically tested, optically inspected, and, if applicable, marked. This means that the total cycle time is independent of the curing period – and this increases performance enormously. On the output spooler, where necessary, an intermediate tape prevents the chip edges from damaging the back of the next layer.
EPP EUROPE 443
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