The Viscom inspection system X8051 MXI/AXI is combining X-ray technology with optical cameras, to provide an optimum solution for all inspection tasks in electronics, including the detection of faults on boards containing SMDs, BGAs and THT components, and also for lead-free solder joints. The concept was developed for automatic X-ray inspection as well as for in-line and off-line operation. It is possible to check boards with dimensions of up to 560 x 710mm (22” x 28-in). Optical inspection can either be performed with standard camera or megapixel modules. The AXI image-field dimensions are extremely variable, ranging from 4 x 5 to 15 x 21mm. The camera modules can be used for a wide range of tasks, such as the automated registration marking analysis or pre-positioning of the inspection windows. In addition, the instrument features a rotating conveying mechanism for objects, so an in-line system can be used for angular inspections in perspectives up to 70°. Another highlight is the highly flexible configuration, to be applied as fully automatic or manual system but also for tomography and laminography. Reportedly, there is no other system on the market which has so many different features. The X8051 MXI/AXI offers a grey-level resolution of up to 16 bit, and comes standard with 12 bit (4096 gradations). Objects with poor contrast can be detected significantly better, and the increased detail recognition is supported by a high-resolution ED tube (enhanced definition). Several software tools are available, e.g. for proprietary image processing and analysis as well as an image-processing software permitting intuitive use. The graphical user interface EasyPro is claimed to allow take up production sooner than with conventional systems. The instrument may also be connected for repair and programming stations as well as an SPC server, and can also be linked to barcode and data-matrix scanners to realize traceability.
EPP EUROPE 453
Share:
