Dyntest develops and produces improved scribe/break systems for the industry manufacturing components of III-V materials like GaAs or InPh. Wafers of such materials are very fragile and therefore difficult to handle and especially difficult to separate into individual chips.
The first product available, model DM-8510, is a semi automated, high precision scriber/breaker. The major features of this new model are enhanced process performance achieved with a unique high precision scribe tool/break backer; improved productivity by semi automated operation; reduced cost of ownership through easier set up, and improved reliability.
As a next step, Dyntest is going to establish an application centre at Grassau (south/east of Munich) to expand the application area of the scribe/ break technology to other semiconductor and electronic components.
EPP EUROPE 455
Share:
