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High precision operation for wafer processing and positioning

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High precision operation for wafer processing and positioning

High precision operation for wafer processing and positioning
The integrated Z-theta motorized stage from J. P. Sercel Associates (JPSA) offers high precision operation for wafer processing and positioning. Its non-contact operation – as opposed to typical worm and wheel rotary designs – reduces maintenance requirements, is less susceptible to wear, and is not affected by torque variations because there’s no gear interface. The stage provides 360 degrees of rotational capability, and its Z-axis capability makes it applicable to a wide range of applications, with the ability to accommodate wafers of varying thicknesses and diameters.

Advantages of the rotary stage include continuous or limited travel, good accuracy and repeatability, a cog-free motor for smooth motion, zero gear backlash, low wobble and bearing run-out, and no accuracy changes over time due to gear wear.
The stage is ideal for laser micromachining applications and wafer processing, among others. Resolution (microns/arc seconds) is 0.25 µm in the Z-axis, and 0.72 arc seconds in the theta-axis; repeatability of ±2 µm in the Z-axis, and ±1 arc second for theta.
EPP Europe 412
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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