Unitek Eapro’s soldering systems for high-power LEDs provide the solder joints on aluminum substrate. These LEDs have to be soldered on a MCPCB (metal composite PCB), which is needed to distract the heat from the LED that will be generated during operation. Because the maximum temperature of the LED may not exceed the 106°C, a reflow-oven will not do the job. A selective soldering device, such as a hot-bar system, must be used. The aluminum substrate forms a big heatsink, so therefore the soldering device must be able to generate high energy density within a short time. The three systems consist of a desktop machine, targeting on lab and prototyping applications. For volume production, two solutions are available: one being a tabletop XYZ-controlled robot with manual loading, the other an in-line system with automatic fiducial alignment, XYZ-movement and rotational head for soldering.
EPP EUROPE 457
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