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High-accuracy, speed eutectic die-bonder

Applications
High-accuracy, speed eutectic die-bonder

Palomar Technologies‘ model 6500 high-accuracy eutectic die-bonder provides a placement accuracy of <1.5 micron/3-sigma and a cycle time of less than 7 sec. per placement. The bonder can automate assembly for advanced applications, such as P-side down laser diode attachment, silicon bench (V-groove) placement, high-density RF power transistors and ultra-fine pitch hybrids. The machine has a footprint of less than 1sqm, is just 38-in (97 cm) wide, 48-in (122 cm) long, and has a height of 70-in (1.78 m). The large bond area is 12 x 6-in (300 x 150 mm). XY-encoder resolution is 0.1 micron. The system has six smart programmable pick tools on a bi-directional rotating tool turret, which can be changed “on the fly“. The 6500 can be customized for any type of presentation media such as automated waffle-pack loader, tape-and-reel feeder, or automated gel-pack loader. Other options include auto-feed mechanism and in-line SMEMA conveyors, or flip-chip die bonding. The die bonder has programmable pulse heating eutectic stages for precise ramp-up and cool-down. Ramp times and repeatability are >100 K/sec (±2K). Advanced packaging technologies for optoelectronic, wireless, and MEMS devices require exact placement of extremely small and fragile components, for which this equipment has been designed.

EPP EUROPE 459
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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