Extreme packing densities and components in lead-less packages represent a challenge in rework. Because of space constraints there is very little chance to work successfully with conventional dispensers. An optional height-measuring feature is integrated in the head of the Martin dispensers, to replace the stand-off pin that sometimes gets in the way in tightly packed boards. This means that solder paste application for lead-less or QFNs (quad flat no-lead packages) automatically ensures precise height and volume – and subsequently accurate rework. When dispensing lines the additional advantage lies in automatically ensuring consistency for uneven substrates as well. The height-sensing technology is not expensive and makes the rework process significantly more secure. The principle behind is the idea of establishing the height of the pad directly from the dispensing nozzle (patented), and is realized with the aid of a cost-effective expansion strip. Users do not have to recalibrate the system after syringe or nozzle change.
EPP EUROPE 428
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