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Flux series for flip-chip bonding

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Flux series for flip-chip bonding

Flux series for flip-chip bonding
Designed for use in both air and nitrogen reflow and halide free, Indium flip-chip bonding fluxes can be obtained individually or as part of a research kit, available in two series, LT and HT. Series LT is for high performance eutectic soldering such as Sn63Pb37 and Sn62Pb36Ag2. Series HT is designed for high melting point solder alloys, for example Pb90Sn10 and Pb95Sn5. Each series consists of fluxes with different viscosities and specifications depending on the processing conditions. For example, a flux with low or medium viscosity can be sprayed onto substrates followed by flip-chip placement. Fluxes can also be dispensed onto the side of the flip chip, allowing the flux to work across the bottom of the chip. Fluxes with higher viscosities can be printed onto the pads, or the chip can be dipped into the flux prior to placement. Both fluxes offer superior wetting ability, wide reflow temperature ranges and extremely low to no residue for no-clean applications. Custom fluxes can also be provided to meet specific requirements.

EPP EUROPE 438
Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
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