The balancing act between maximum speed and very high precision is reportedly not a problem for Datacon’s flip-chip platform 8800 FC. The company’s experience in the field of this technology has given rise to a bonder for high-volume production, which features an exceptional throughput of up to 10,000 uph. Even at full speed, positioning to ±10 µm (at 3-sigma) is guaranteed. Extensive parallelization of the process steps has allowed for high throughput without any compromises, resulting in high efficiency without endangering process stability, which is important for high yields. The platform handles the entire process spectrum of flip-chip assembly, from classical solder-bumping up to adhesive techniques (ACA, ICA and NCA), right through to thermocompression bonding. The machine can process a multitude of different substrates, such as leadframes, BGA strips, boats and carriers, and mount them on up to 12-in wafers. Datacon has invested more than 4 m euro in the development of an innovative flip-chip platform in recent years. With the appearance of this cutting-edge equipment, it will now be possible to multiply existing levels of productivity.
EPP EUROPE 441
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