With its 8800 FC Quantum series, Datacon can make its mark in the sensitive segment of flip-chip bonding of sophisticated and complex high-end components with a leading integrated device manufacturer (IDM). The flip chip bonder’s high-speed achieves a throughput of 10,000 UPH (dry cycle) with a precision of 10 µm@3 s, thanks to parallel processing via two collision-protected gantries, each fitted with a bond head and substrate camera, two slide fluxers and upward-looking cameras.
The dual head flip chip bonder processes the entire spectrum of bond and bump technologies for flip chip assembly. The open concept can accommodate the increasing future demands of flip chip processing and also allows for the integration of dispensing.
EPP Europe 444
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