CircuitMedic now offers an easy and reliable method for stencil printing solder paste on individual Ball Grid Array (BGA) component sites for rework; accurate, disposable Flextac stencils.
The stencils have an adhesive side that attaches temporarily to the PCB, preventing misalignment and solder paste smearing. Because the stencils are inexpensive and disposable, they help users keep lead-bearing and lead-free soldering materials separate, preventing cross-contamination, which can happen in a facility processing or reworking older assemblies using tin/lead solders and newer boards that are lead-free, to help RoHS compliance. The stencils themselves are also RoHS compliant.
The stencils are part of a complete BGA stencil kit from CircuitMedic that includes 20 different sizes of BGA rework stencils, a spatula handle and three sizes of spatula blades.
The flexible solder paste stencils are laser cut for correct aperture size. They are cut from high quality, anti-static polymer film with a residue-free adhesive backing. Because they are self-sticking, no tape or fixturing is needed. The adhesive seals around each BGA pad to prevent solder paste from bleeding under the stencil when solder paste is applied. The stencils are easy to use and leave no residue on the board surface.
EPP EUROPE 426
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