Universal Instruments has added an on-line wafer expander option to its wafer feeder system for semiconductor assembly. The expander will be especially valuable when processing single part number 300mm wafers, but the company has also retained the off-line wafer expansion capability for multi-part number processing. The wafer feeder is compatible with standard sizes, including 300, 200 and 150mm, and accepts 25 cassettes. It provides a versatile platform from which to load wafers for backend packaging processes. Other features are: programmable die ejection, theta correction and expansion, combined with wafer mapping and ink-dot recognition, barcode identification and tracking of wafers. High throughput is inherent to the loader design. Maximum use of parallel processing has pared tact time to as low as 1 sec. per die. Designed on a small footprint of (1.17 x 0.94m), the feeder forms part of a space-efficient processing capability, and is compatible with class 10,000 cleanrooms.
EPP EUROPE 444
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