Today’s PCBs are not only densely populated with SMDs, but are also assembled with through-hole devices (THDs) such as connectors, capacitors, circuit breakers and special components, and selectively soldered. Frequently PCBs are soldered on both sides. With the Viscom S3016, these components can now be completely inspected from below, eliminating the time needed to flip assemblies over. The System is specially designed to inspect THD and SMD selective solder joints on double-sided PCBs and for other similar applications. This robust inspection concept reliably detects open solder joints, solder bridges, missing leads and other defects from below. Expensive PCB flip stations are eliminated, resulting in significant cost savings. The AOI-System employs high-performance 6M camera technology to guarantee maximum inspection depth and rapid inspection speed, even under extremely high line rates. An X/Y positioning unit guides the camera module beneath the PCB to capture images from specified locations, switching illumination to suit the individual inspection task. Images are evaluated while the camera moves to its next position, significantly cutting cycle times. Simplified program transfer and rapid program generation are additional highlights. Repair and post-classification stations and VPC process evaluation are available as optional modules.
SMT, hall 7, booth 211
EPP Europe 477
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